国家/地区 中国（2）
IPC部 C（2）
IPC大类 F41（2）
IPC小类 F41H（2）
IPC F41H005/04（2）
发明人
公开年 2021（2）
申请年 2020（2）
专利权人

Endothermic adhesive film used as bonding material of bulletproof board, comprises film base made of film adhesive and heat-conducting material.

TIAN K, LI X, JI C, DUAN Y, CHEN X, GE A, WANG Q, ZHANG J, LI Y, WANG L, ZHAO Y

Preparation of boron carbide composite ceramic plate used for bullet-proof plug board, involves mixing boron carbide powder and graphene suspension, adding base material, granulating, drying, adding to graphite mold, heating, and cooling.

GAO D