国家/地区 中国（2） 欧洲专利局（EPO）（2） 美国（2）
IPC部 B（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC C09D201/00（2）
发明人
公开年
申请年
专利权人

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q