国家/地区 中国（2）
IPC部 B（2） C（2） H（2）
IPC大类 C08（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人
公开年
申请年
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Conductive ink useful for providing a conductive coating on a substrate, comprises a conductive polymer solution comprising conductive polymer dissolved in an aqueous-based media, and a mixture of carbon nanotubes and graphene oxide sheets.

BAO H, ZIN M, JULIUS D, LEOLUKMAN M, KIM M