国家/地区 中国（3）
IPC部 C（2）
IPC大类
IPC小类
IPC
发明人 LAI C（3） LIN W（3） ZHOU F（3）
DAI J（2）
公开年 2017（3）
申请年 2017（3） 
专利权人 TRULY SEMICONDUCTORS LTD（3）

Main plastic composite material backlight source heat conducting glue frame comprises main plastic, filler, three-dimensional graphene, dispersant, and antioxidant.

ZHOU F, LAI C, DAI J, LIN W

Adhesive comprises acrylic glue, modified aluminum nitride, graphene oxide, tackifying resin and dispersant.

ZHOU F, LAI C, LIN W

Direct backlight module for use in LED lamp, contains bottom frame, light source and diffusion plate, where bottom frame is made of heat plastic material that consists of main plastic, filler, graphene, dispersant, and antioxidant.

ZHOU F, DAI J, LIN W, LAI C