国家/地区
IPC部 C（2）
IPC大类 C23（2） C25（2）
IPC小类 C23C（2）
IPC C23C028/04（2）
发明人
公开年 2021（2）
申请年 2020（2）
专利权人

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Method for preparing titanium-based iridium dioxide complex graphene and manganese-molybdenum oxide electrode comprises e.g. pre-processing titanium substrate, preparing electrodeposition liquid and using titanium-based iridium dioxide.

GENG H, LI Y