国家/地区 中国（2） 美国（2） 世界知识产权组织（2）
IPC部 B（4） H（3） C（2）
IPC大类 B29（4） C08（2） C09（2）
IPC小类 B29C（4） C08J（2） C08L（2）
C09D（2）
IPC B29C045/14（4）
发明人
公开年 2022（4）
申请年 2021（4）
专利权人

Injection molding of surface portion for carbon fiber-reinforced thermoplastic composite, involves providing mold cavities, compounding fiber reinforced polyamide with acrylonitrile butadiene styrene and injecting polyurethane material.

BALTAZARYJIMENEZ A, ASTHANA S, KRULL B A

Method for forming a foldable plastic for providing protection for below ground devices, such as water meters, involves providing material suitable for molding and placing material in molds to form sides with assembling the sides.

THOMPSON R G, NOLEN D K

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Semiconductor flexible refrigeration cloth for e.g. bioelectrons, has flexible substrate filled between function layer and provides support frame to support liquid metals, where connection point is set between metal caps of P semiconductor particle and end surface of N semiconductor nanoparticles.

ZHAO X, SHI S, LI H, HUO Y, XING Y, ZHANG H, WANG S, ZHOU Y, LI G, XU Z