国家/地区 美国（2）
IPC部 B（2） C（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC
发明人
公开年 2022（2）
申请年 2022（2）
专利权人

Photomask used in semiconductor industry, comprises substrate, and polymer layer over surface of substrate, where polymer layer comprises thermoplastic polymer and hydrophobic layer, and thermoplastic polymer is set between hydrophobic layer and surface of photomask.

LIN C, WEN C, LIU T H

Universal barrier system used to form moisture shield and thermal break in building, has universal barrier tape made from polyethylene film, universal barrier components and universal barrier edging having polyethylene film base material.

GARCIA J