国家/地区 中国（2）
IPC部 B（2）
IPC大类 B29（2）
IPC小类 B29B（2）
IPC
发明人 YE H（2）
公开年 2022（2）
申请年 2021（2）
专利权人

Multi-layer printed circuit board plate production process inner and outer layer spiral extrusion line plate forming method, involves utilizing cooling structure to cool and dry printed circuit board plate material, and promoting plate material solidifying and forming processes.

LAI J, CHEN X, SU H, ZHANG H, YE H

Preparing modified polybutylene adipate terephthalate biodegradable plastic involves firstly placing PBAT particles in blast oven, drying, taking out, and adding plasticizer, stirring mixture, and placing in torque rheometer.

XU K, PAN J, YE H, XU L, ZHANG Y