国家/地区 中国（2）
IPC部 B（2）
IPC大类 B29（2）
IPC小类 B29B（2）
IPC B29B007/24（2）
发明人
公开年 2022（2）
申请年 2022（2） 
专利权人

Encapsulating flexible phase change material by double network useful for thermal management fields i.e. fifth generation chips and lithium-ion batteries, comprises e.g. heating paraffin in oil bath, absorbing liquid paraffin, cooling mixed material and hot pressing to solidify natural latex.

FANG X, LING Z, YANG K, ZHANG Z

Preparing high thermal conductivity resin useful for PCB plug holes, comprises e.g. introducing thermally conductive filler and low dielectric loss resin into preheating machine, carrying out preheating treatment to it by preheating machine; weighing graphene, and passing into mixing drum.

NIE X