国家/地区 中国（2）
IPC部 B（2）
IPC大类 B29（2）
IPC小类 B29B（2）
IPC
发明人 CHEN X（2）
公开年 2022（2）
申请年
专利权人

Preparing black master batch for thin film soft package useful for thin film soft package used for lithium-ion pouch cell, comprises using double-screw extruder under special screw thread and component screw combination condition.

CHEN X, LI Z, JIA L, LIN X, LIAO G

Multi-layer printed circuit board plate production process inner and outer layer spiral extrusion line plate forming method, involves utilizing cooling structure to cool and dry printed circuit board plate material, and promoting plate material solidifying and forming processes.

LAI J, CHEN X, SU H, ZHANG H, YE H