国家/地区
IPC部 B（2）
IPC大类 B29（2）
IPC小类 B29C（2）
IPC C09D011/102（2） C09D011/52（2）
发明人
公开年 2022（2）
申请年
专利权人

Composition for use in three-dimensional printing of electronic devices, comprises at least triphenylamine which is used as a powder binding agent in the composition, where the composition is to be melted and extruded on a structure.

GLENN C M

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A