国家/地区
IPC部 C（2）
IPC大类 C25（2） H01（2）
IPC小类 C25D（2）
IPC C25D015/00（2）
发明人
公开年 2022（2）
申请年 2022（2） 
专利权人

Electrolyte for electrodeposition of copper on semiconductor substrate, comprises copper ions, solvent, and amine that complexes copper ions and graphene.

MEVELLEC V, DOUSSOT C P, CAILLARD L

Packaging carrier plate has alumina ceramic plate whose one surface has three-dimensional conical structure layer of alumina ceramic, where copper-graphene composite material layer is compounded on three-dimensional conical structure layer.

LIANG N, WU S, WANG J, SUN C, ZHANG D, ZHANG W, SONG X