国家/地区 中国（2）
IPC部 B（2） C（2）
IPC大类 B32（2）
IPC小类 B32B（2） C08K（2） C08L（2）
IPC B32B033/00（2）
发明人
公开年 2023（2）
申请年 2023（2）
专利权人

Preparing silicon dioxide filling type epoxy resin copper-clad plate by vacuum-drying nano-silicon dioxide powder, mixing with gamma-aminopropyltriethoxysilane, adding to xylene, drying, dispersing oxidized graphene- silicon dioxide composite material, covering copper foil and curing.

XIE J, WANG X, CHEN Y

High ductility and high temperature resistant composite food packaging film useful for food packaging or food preserving, comprises modified composite film layer which is base modified film layer, maleic anhydride graft polyethylene resin film middle layer and polyethylene outer film layer.

CHEN C