国家/地区 中国（2）
IPC部 H（2）
IPC大类 H10（2）
IPC小类
IPC
发明人 ZENG C（2）
公开年 2023（2）
申请年 2022（2）
专利权人 UNIV CHINA SCI TECHNOLOGY（2）

Encapsulation method for improving graphene of carrier concentration, involves manufacturing graphene, performing secondary uniform glue to substrate of graphene uniformly gluing and baking substrate of chip with polymethyl methacrylate(PMMA)solution, using mixed doping agent, controlling graphene.

LI L, FAN X, LIN Z, WAN X, ZENG C

Method for opening double-layer graphene band gap in semiconductor device, involves using first molecular layer for electronic doping double layer graphene, and second molecular layer to perform hole doping of double-layered graphene to open band gap.

ZHANG D, FAN X, ZHANG H, ZENG C