国家/地区
IPC部 B（2） C（2）
IPC大类 B05（2）
IPC小类 B05D（2）
IPC B05D003/02（2）
发明人
公开年 2023（2）
申请年 2021（2）
专利权人

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Manufacturing coated glove having conductive coating layer comprises e.g. preparing conductive coating solution by mixing polymer, conductive material, crosslinking agent, and diluent, and coating conductive coating liquid.

YUN C H, PARK C, SU J, CHOI Y I, WOOK L