国家/地区 韩国（2）
IPC部 B（2） C（2） H（2）
IPC大类 C08（2）
IPC小类 C08K（2） C08L（2）
IPC C08K003/013（2）
发明人
公开年 2023（2）
申请年 2022（2）
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Preparing hydrogel for energy storage device, involves forming pre-gel comprising polymer and metal salt particles, shrinking and dehydrating pre-gel and impregnating shrunk and dehydrated pre-gel with ion solution to cross-link and rehydrate shrunk and dehydrated pre-gel to produce hydrogel.

JI D, KIM J Y, HWAN J D