国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3） C09（3）
IPC小类 C08K（3）
IPC C08L023/08（3）
发明人
公开年 2023（3）
申请年 2022（3） 
专利权人

Heat conducting filler master batch used in polypropylene composite material for extruding and absorbing plastic and preparation of electronic components, comprise high pressure polyethylene, aluminum oxide, graphene, coupling agent, dispersant, and antioxidant.

CHEN P, XU H, SHE H, HUANG F, CHEN X, GONG W

Fluorine-containing plastic heat-conducting gasket comprises resin, crosslinking agent, catalyst, heat conducting filler and fluorine plastic powder.

WU X, LI F, CHEN J

Composite material useful in field of electronic component comprises e.g. poly(butylene terephthalate), graphene micro sheet, carbon nanotubes, ethylene methyl acrylate glycidyl methacrylate terpolymer, gamma-aminopropyltriethoxysilane and vinyl acetate ethylene copolymer emulsion.

YI Q, LU J, WANG Z