国家/地区 中国（6）
IPC部 C（7） H（4）
IPC大类 C08（7） C09（7） H01（3）
IPC小类 C08J（7）
IPC C09K005/14（7）
发明人 CHEN J（2）
公开年 2023（7）
申请年 2022（7）
专利权人

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Heat conducting filler master batch used in polypropylene composite material for extruding and absorbing plastic and preparation of electronic components, comprise high pressure polyethylene, aluminum oxide, graphene, coupling agent, dispersant, and antioxidant.

CHEN P, XU H, SHE H, HUANG F, CHEN X, GONG W

Polyurethane high-thermal conductivity film used as photothermally controllable film, is prepared by reacting three-dimensional carbon composite powder and thermoplastic polyurethane, concentrating obtained three-dimensional carbon/polyurethane assembly, dripping on substrate and heat-treating.

CHEN J, WANG C, LI H, LUO W

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Preparing heat intelligent material by mixing agglomerant, heat conducting material, thermal expansion material and solvent, freezing first mixture, impregnating second mixture, curing and obtaining heat intelligent material.

WANG J, YANG Y

Preparing perovskite quantum dot/4-aminophenylporphyrin/graphene oxide high thermal conductivity composite film used in heat dissipation comprise coating toluene dispersion of perovskite quantum dots on 4-aminophenylporphyrin, and graphene oxide composite thermal conductivity film.

WANG S, LUAN Y

Fluorine-containing plastic heat-conducting gasket comprises resin, crosslinking agent, catalyst, heat conducting filler and fluorine plastic powder.

WU X, LI F, CHEN J