国家/地区 中国（6）
IPC部 B（7）
IPC大类 B32（7） C03（2） H01（2）
IPC小类 B32B（7） C03C（2）
IPC B32B017/06（7）
发明人
公开年 2023（7）
申请年 2022（6） 
专利权人

Wave-absorbing sandwich composite material based on honeycomb transverse structure, has upper wave-transmitting layer, middle wave-absorbing layer and lower reflecting layer, where middle wave-absorbing layer is one layer of wave-absorbing honeycombs transverse to thickness direction of honeycomb.

ZHAO G, WU C, HUANG S, LIU Y

Satellite surface wave-absorbing skin structure for satellite, has thermal control layer bonded to upper surface of wave-transmitting enhancement layer, wave-absorbing honeycomb layer, and reinforced shielding layer for isolating electromagnetic wave penetration on both sides of absorbing skin.

FU X, MI X, ZHANG H, WANG X, GAO W, XU Y

Mica tape with reinforced wrapping edge used in electric industry, has wrapping mica paper layer that is attached to side of polyimide film layer of mica baseband wrapped by reinforcing fiber fabric layer side.

ZHAO J, CHU G, WU H

Laminated glass, comprises middle film provided between first laminated glass and second laminated glass, where middle film contains coating which is inorganic thermal insulation coating comprising tin-doped indium oxide particles or cesium-doped tungsten oxide particles.

ZHANG W, CHEN J

Low dielectric composition useful in laminated plate of printed circuit board, comprises epoxy resin, hardener comprising flame retardant hardener and benzoxazine resin, halogen free flame retardant, accelerator, additive comprising inorganic filler, toughening agent and solvent.

YAO J, GONG J, CHEN S, TANG F

Glass article useful in device, comprises ion-exchanged glass layer, negatively doped graphene layer having negatively doped graphene layer first major surface and negatively doped graphene layer second major surface.

BHATTACHARYYA I, MARCHENA MARTINFRANCES M, MAZUMDER P, PRUNERI V

Antistatic structure of silica gel tube, has wearable antistatic mechanism that comprises wearable layer, first placing groove, aramid material, high temperature resistant layer, second placing groove and graphene material.

WANG Z