国家/地区 世界知识产权组织（4）
IPC部 B（4）
IPC大类 B29（4）
IPC小类 B29C（4）
IPC B29C064/00（2） B33Y010/00（2） G01N033/543（2）
发明人
公开年 2023（4）
申请年 2022（4） 
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Two-photon polymerization compatible photosensitive ink or resin used in fabricated device including micro/nanoelectronic, battery, optic element, flexible electronic device, printed circuit board, and chip-scale electronic, comprises organic semiconductor, crosslinker, photoinitiator, and solvent.

ABIDIAN M R, DADRASTOUSSI O, KHORRAMI M, MAJD S

Sinterable polymer composition used in powder, comprises random copolymer of propylene and olefinic comonomer, clarifier and nucleator, and antioxidants, acid scavenger, peroxide, enhanced infrared energy absorber, long-term heat agent, and polyolefin elastomer.

SING M K, MOHAMMADI H, WERLANG M M, DE AZEREDO A P, FALLON J, HERRINGTON K, AZINGER C

Coating composition used to coat paper pulp renders it waterproof and completely biodegradable, comprises graphene oxide nanoparticles, globular protein, plasticizer, thickener, filler, fungicide and water.

GANERIWAL S