国家/地区 日本（3）
IPC部 B（3）
IPC大类 B32（3）
IPC小类 B32B（3）
IPC B32B007/025（2）
发明人
公开年 2023（3）
申请年 2022（2） 
专利权人

Crystalline carbon substrate material has surface that is flattened by forming single layer or multiple layers of metal film having thickness of 100 nm or more on substrate surface by vacuum film forming process and hot-pressing entire surface in vicinity of melting point of metal film.

HIRAI A

Electronic component package, comprises polymeric core comprising first polymeric material and an outer overmold layer comprising second polymeric material containing graphene, outer overmold layer defining a case skin disposed on polymeric core,where first and second polymeric are thermoplastic.

NARITA M, SARANG S, KHAN S

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D