国家/地区
IPC部 B（2）
IPC大类 B29（2）
IPC小类 B29C（2）
IPC C08K003/04（2）
发明人
公开年 2023（2）
申请年 2022（2）
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Preparation of electrothermal carbon fiber composite material based on crosslinking reinforcement by coating graphene oxide aqueous solution on surface of carbon fiber, carbon fiber yarn or carbon fiber fabric as base material, and forming composite material by vacuum-assisted resin transfer molding.

DAI M, HONG X