国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5） C09（5）
IPC小类 C08K（5）
IPC C08K009/04（5）
发明人
公开年 2023（5）
申请年 2022（4） 
专利权人

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Rubber composition useful for preparing sealing strips, comprises e.g. ethylene-propylene diene monomer rubber, silicon dioxide, anti-aging agent, vulcanizing agent, and silicon dioxide surface-modified compound.

HUA H, LI W, WANG J

Self-adhesive heat-conducting silicon gel, comprises raw material as polyethylene glycol, modified heat-conducting filler, dimethyl silicone oil and dimethicone coupling agent.

REN B, ZENG X, ZHANG M, JIN L, LI H, LIU H, CHENG X, WU X

High thermal conductivity composition useful for preparation of thermally conductive materials, comprises grafted resin, curing agent e.g. cetyl ammonium bromide, thermally conductive filler e.g. aluminum oxide and modified graphene oxide.

YANG X, WAN F, TAN P

Preparing phase change graphene composite material useful as battery pack radiating material, comprises e.g. adding titanate coupling agent and aqueous ammonia, dissolving pyromellitic dianhydride and 4,4'-diaminodiphenyl ether in solvent, and polymerizing modified graphene oxide and isoquinoline.

HUANG Z, ZHOU Z, ZHU Q, ZHENG Z