国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08L（2） H05K（2）
IPC C08L009/00（2）
发明人
公开年
申请年 2021（2）
专利权人

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C