国家/地区 中国（3）
IPC部 C（3）
IPC大类 C09（3）
IPC小类 C09J（3）
IPC C09J183/04（3）
发明人 LIU S（3）
公开年
申请年
专利权人

New alpha,omega-dihydroxypolysiloxane useful as sealing material for caulking of deformation joint in radioactive region, or sealing of reserved hole.

WANG Y, WANG X, SUN X, LIU S, LI D, JIANG W, YANG J, ZHAO W, SHAO Y, LI Y

Low-temperature curing conductive adhesive for solder joint or seam, comprises liquid metal conductive particles, thermosetting resin, organic acid activator, corrosion inhibitor, thixotropic agent, solvent, curing agent.

XU P, WANG S, LIU S

Preparing weather-resistant photovoltaic back plate material involves dissolving polyvinylpyrrolidone in anhydrous ethanol and binder, and subjected to ultrasonic dispersion to obtain viscous liquid, aluminum powder and graphene powder.

LIU S, YOU L, FANG Z