国家/地区 中国（2）
IPC部 C（2）
IPC大类 C09（2） H05（2）
IPC小类 C09J（2）
IPC C09J011/04（2）
发明人
公开年 2021（2）
申请年 2021（2）
专利权人

Preparing high-temperature-resistant low expansion coefficient copper clad laminate, involves coating high heat-conducting medium layer on one side of aluminum substrate, installing copper foil layer on one side of medium layer, and coating heat dissipation adhesive layer on other side of substrate.

LI Y, LIU Q, SU X

Preparing electromagnetic reflecting material with high transverse longitudinal specific heat management structure comprises e.g. uniformly coating graphene slurry on aluminum metal plate, drying, cutting, bonding, pressing and molding.

FU H, XU F, ZHAO X, HOU J, PENG Q, HE X