国家/地区 中国（2）
IPC部 C（2）
IPC大类 C22（2）
IPC小类 C22F（2） C23C（2）
IPC C22F001/08（2）
发明人 LI L（2）
公开年 2021（2）
申请年 2021（2）
专利权人

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Manufacturing copper alloy for hydrocooling exchangers based on single crystal silicon smelting comprises e.g. preparing furnace material comprising chromium, zirconium, silicon, magnesium, rare earth, and graphene supported cerium powder.

ZHANG Q, ZHANG H, YU G, LI L, MA M, WU B, WANG C, JING L