国家/地区 中国（2）
IPC部 B（2）
IPC大类 B22（2）
IPC小类 B22F（2）
IPC
发明人
公开年
申请年 2017（2）
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Preparing graphene modified zinc powder used for coating materials, involves mixing uniformly graphene solution and zinc powder to obtain mixture, subjecting mixture to rotary evaporation to obtain modified zinc powder.

LIU H, ZHANG Z, ZHAO Y, YUAN Q