国家/地区 中国（4）
IPC部 B（4）
IPC大类 B32（4） H05（3） H01（2）
IPC小类 B32B（4）
IPC B32B015/08（4）
发明人
公开年 2021（3）
申请年 2021（4）
专利权人

Multifunctional conductive foam for use as buffer or anti-static buffer pad of electronic device or electronic product, has metal knitted foam whose upper and lower surfaces are coated with conductive cloths by hot melt adhesive.

GUO D, HU X

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Electrochemical device comprises electrode assembly and shell, where electrode assembly is set in shell and shell comprises packaging film and first layer.

LV W

Graphene anti-ice dialing intelligent temperature control structure useful in the field of anti-icing dam insulation layer comprises e.g. polyurethane insulating layer orderly laminated on the base surface of dam body and leveling layer.

LIU E, HONG Y, XU X, XU H, ZHU G, QIU D, MAO K, QI X, ZHOU W, GAO G, HAN J, ZHANG H, ZHANG J, CHEN D, ZHANG Y, HOU J, ZHAO D, WANG J, QUAN Y, LIN F