国家/地区 中国（3）
IPC部 B（3）
IPC大类 B22（3）
IPC小类 B22F（3）
IPC B22F003/04（2） C21D001/18（2） C22F001/08（2）
发明人 LIU L（2）
公开年 2021（2）
申请年 2020（3）
专利权人

Preparing high-damping copper-aluminum-manganese shape memory alloy, involves crushing copper zirconium compound inoculant ingot, mixing inoculant particles with multi-layer graphene, ball milling, drying composite powder, and solidifying.

WANG Q, JIAO Z, YIN F, ZHANG J, LIU L, JI P, YAO C

High strength high conductivity graphene-copper composite wire comprises graphene, impurity element and copper.

YANG Z, FENG X, XIE H, PENG L, HUANG G, ZHANG W, MI X

Preparing high corrosion resistance medium entropy quench and partitioning steel comprises e.g. preparing graphene oxide/alluminum composite powder, preparing graphene solution by adding graphene to deionized water.

LIU H, LIU L, YANG H, SUN F, JING X, PEI C