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C25(2)
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C25D003/38(2)
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Graphene heat dissipation coating comprises electrically treating graphene, silicon oxide nanofiber material and nano copper particles, nano copper particles are deposited by electrodeposition in composite material formed.
CHEN W, ZHOU M
Directly plating circuit board based on graphene film comprises e.g. heating graphene oxide containing a specific functional group, dispersing heat-treated graphene oxide in an aqueous solution, ultrasonically stirring and centrifuging.
ZHOU Q, SONG W, LIU G, PAN Z, HU G, WEI Z
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