国家/地区 中国（2）
IPC部 B（2） C（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC B32B009/00（2） B32B009/04（2） B32B037/00（2）
发明人
公开年 2021（2）
申请年 2021（2）
专利权人

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Preparing high toughness layered titanium-based composite material comprises e.g. depositing graphene oxide and silicon powder on titanium foil of cathode, stacking surface co-deposition graphene oxide-silicon coating layer and sintering.

HUO W, LEI C, WU H, LI L, CHANG G, LI X, ZHANG Y