国家/地区 台湾（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC
发明人 CHANG C（2）
公开年 2021（2）
申请年
专利权人

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Device comprising physical properties controlled by microstructure, comprises base layer having patterned surface, and two-dimensional structure layer formed on patterned surface of base layer.

CHEN T, HO S, HSIEH Y, CHANG C, CHANG C H