国家/地区 台湾（3）
IPC部 B（3）
IPC大类 C09（3） A61（2） B82（2）
C01（2） C08（2）
IPC小类 C09D（3）
IPC C09D011/52（3）
发明人
公开年 2021（2）
申请年 2021（3）
专利权人

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Nanocarbon dispersion used in resin composition for forming composite material for e.g. solder paste flux, automobile cables, polyacrylonitrile-based carbon fiber blended products, pressure sensors and rubber/resin composite materials, comprises nanocarbon and rosin or its derivative as dispersant.

HIROYOSHI K, MASATO S, YUJI K, SHIRATORI M, KAWAMATA Y, KAWASAKI H

Dispersion useful for manufacturing additive for encapsulating electronic components, comprises portion of cross-linkable moiety, and oxidized discrete carbon nanotubes with bonded dispersing agent.

IVANOVA O, LOWDER S, SWOGGER K W, BOSNYAK C P