国家/地区 美国（2）
IPC部 C（2）
IPC大类 C22（2）
IPC小类 C22C（2）
IPC
发明人 AURONGZEB D M（2）
公开年 2023（2）
申请年 2021（2）
专利权人 DELL PROD LP（2）

Solder composition used in solder joints of printed circuit boards, comprises a compound layer comprising an alloy of bismuth and tin, and a graphene coating positioned on the compound layer.

AURONGZEB D M

Covering of fan unit of information handling system, eg. laptop computers, has first part of conductive plastic and post-consumer-recycled plastic and/or biodegradable plastic, second part of copper and aluminum alloy, where both parts form volume of space in fan unit, to contain motor and blades.

GOH P L, SCHWAGER M A, AURONGZEB D M