国家/地区 美国（3）
IPC部 B（3）
IPC大类 C08（3）
IPC小类 C09D（2） H01L（2）
IPC C09D007/40（2） H01L023/532（2）
发明人 CHEN C（3）
公开年
申请年
专利权人

Producing food packaging barrier film used for consumers to clearly see content of packaged goods, involves providing base film, depositing inorganic laminated film on surface of base film, where inorganic laminated film includes at least one first and second inorganic material deposition layer.

CHEN C, TSAO C, LIAO T, LIAO T C, TSAO C C, CHEN C H, CHEN Z, CAO J, LIAO D

Method for fabricating topological semi-metal interconnect, involves forming dielectric layer between interconnects, and forming hermetic cap layer on top of one or more interconnect.

NOGAMI T, NARAYANAN V, LANZILLO N A, CHEN C, RANJILO N A

Printed electronic device such as integrated circuit and printed circuit board comprises substrate and layer of electrically conductive ink comprising functionalized graphene sheets and binder applied to the substrate.

AKSAY I A, CHEN C, CHIANG K S, KORKUT S, LETTOW J S, PRUDHOMME R K, CRAIN J M, AKSAY I, CHIANG K, LETTOW J, PRUDHOMME R, PRUD HOMME R K, KORKUT S A, PRUD H R K, AKSAY L A