国家/地区 美国（4）
IPC部 F（4） C（3） H（2）
IPC大类 F28（4） C09（3） H01（2）
H05（2）
IPC小类 F28F（4） C09K（3） F28D（2）
H01L（2） H05K（2）
IPC F28F021/00（4）
发明人 JANG B Z（2） XIONG W（2） ZHAMU A（2）
公开年
申请年
专利权人 NANOTEK INST.（2）

Thermally conductive composite material used in electronic device e.g. CPU, comprises unitary graphene matrix material which is single crystal or polycrystalline, and contains chemically bonded graphene molecules or merged graphene planes.

ZHAMU A, XIONG W, JANG B Z, LIN Y

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J

Integrated heat sink used in electronic device e.g. battery, camera unit comprises unitary graphene material article composed of heat collection member and heat dissipation member integral to the heat collection member.

ZHAMU A, WANG M, XIONG W, JANG B Z, YIJUN L

Thermal management assembly for e.g. fuel cells, comprises heat sink including graphite layer (exhibiting thermal conductivity, which is anisotropic in nature) obtained by cleaving graphene layer from graphite sheet, and support layer.

SAYIR H, MEHMET A, COOPER E B, ICOZ T, SCHAEPKENS M, LIU X