IEEE TRANSACTIONS ON INSTRUMENTATION MEASUREMENT

OE T, RIGOSI AF, KRUSKOPF M, WU BY, LEE HY, YANG YF, ELMQUIST RE, KANEKO NH, JARRETT DG

ACS APPLIED ELECTRONIC MATERIALS

WU BY, YANG YF, RIGOSI AF, HU JN, LEE HY, CHENG GJ, PANCHAL V, KRUSKOPF M, JIN H, WATANABE K, TANIGUCHI T, NEWELL DB, ELMQUIST RE, LIANG CT

IEEE TRANSACTIONS ON INSTRUMENTATION MEASUREMENT

RIGOSI AF, PANNA AR, PAYAGALA SU, KRUSKOPF M, KRAFT ME, JONES GR, WU BY, LEE HY, YANG YF, HU JN, JARRETT DG, NEWELL DB, ELMQUIST RE

JOURNAL OF ALLOYS COMPOUNDS

LEE HY, HEISH YC, LEE CT

SCIENTIFIC REPORTS

HU JN, RIGOSI AF, KRUSKOPF M, YANG YF, WU BY, TIAN JF, PANNA AR, LEE HY, PAYAGALA SU, JONES GR, KRAFT ME, JARRETT DG, WATANABE K, TANIGUCHI T, ELMQUIST RE, NEWELL DB

PHYSICAL REVIEW B

HU JN, RIGOSI AF, LEE JU, LEE HY, YANG YF, LIU CI, ELMQUIST RE, NEWELL DB

MICROELECTRONIC ENGINEERING

RIGOSI AF, LIU CI, WU BY, LEE HY, KRUSKOPF M, YANG YF, HILL HM, HU JN, BITTLE EG, OBRZUT J, WALKER ARH, ELMQUIST RE, NEWELL DB

NANOSCALE

LIU FH, LO ST, CHUANG CS, WOO TP, LEE HY, LIU CW, LIU CI, HUANG LI, LIU CH, YANG YF, CHANG CYS, LI LJ, MENDE PC, FEENSTRA RM, ELMQUIST RE, LIANG CT

SMALL

RIGOSI AF, GLAVIN NR, LIU CI, YANG YF, OBRZUT J, HILL HM, HU JN, LEE HY, WALKER ARH, RICHTER CA, ELMQUIST RE, NEWELL DB

2D MATERIALS

LIU CW, CHUANG CS, YANG YF, ELMQUIST RE, HO YJ, LEE HY, LIANG CT