IEEE TRANSACTIONS ON INSTRUMENTATION MEASUREMENT

PAYAGALA SU, RIGOSI AF, PANNA AR, POLLAROLO A, KRUSKOPF M, SCHLAMMINGER S, JARRETT DG, BROWN R, ELMQUIST RE, BROWN D, NEWELL DB

NANO LETTERS

JIANG YX, LU ZG, GIGLIOTTI J, RUSTAGI A, CHEN L, BERGER C, DE HEER W, STANTON CJ, SMIMOV D, JIANG ZG

2D MATERIALS

CELLINI F, LAVINI F, BERGER C, DE HEER W, RIEDO E

METROLOGIA

KRUSKOPF M, ELMQUIST RE

THIN SOLID FILMS

KRUSKOPF M, PIERZ K, PAKDEHI DM, WUNDRACK S, STOSCH R, BAKIN A, SCHUMACHER HW

MICROELECTRONIC ENGINEERING

RIGOSI AF, LIU CI, WU BY, LEE HY, KRUSKOPF M, YANG YF, HILL HM, HU JN, BITTLE EG, OBRZUT J, WALKER ARH, ELMQUIST RE, NEWELL DB

2D MATERIALS

RIGOSI AF, HILL HM, GLAVIN NR, POOKPANRATANA SJ, YANG YF, BOOSALIS AG, HU JN, RICE A, ALLERMAN AA, NGUYEN NV, HACKER CA, ELMQUIST RE, WALKER ARH, NEWELL DB

APPLIED SURFACE SCIENCE

FERRALIS N, CARRARO C

NANO LETTERS

KUNC J, HU YK, PALMER J, GUO ZL, HANKINSON J, GAMAL SH, BERGER C, DE HEER WA

NANOTECHNOLOGY

ZHANG Y, HUI C, SUN RJ, LI K, HE K, MA XC, LIU F