国家/地区 Taiwan（19）
关键词 THERMAL CONDUCTIVITY（19）
出版物 COMPUTATIONAL MATER.（2） POLYMERS（2）
出版时间 2019（4） 2022（3） 2013（2） 2015（2） 2018（2） 2020（2） 2021（2）
机构 NATL CHIAO T.（2） NATL TAIWAN .（2） YUAN ZE UNIV（2）
作者 HSIEH CT（2） TSAI JL（2） TSAI MH（2） TSENG IH（2）
WANG TY（2）

Improvement of the Heat-Dissipating Performance of Powder Coating with Graphene

POLYMERS

KUNG F, YANG MC

Thermal transport on composite thin films using graphene nanodots and polymeric binder

THIN SOLID FILMS

GU SY, HSIEH CT, LIN WC, MALLICK BC, GANDOMI YA

Enhancing Thermoelectric Properties of 2D Bi2Se3 by 1D Texturing with Graphene

ACS APPLIED ENERGY MATERIALS

WU JK, HOFMANN M, HSIEH WP, CHEN SH, YEN ZL, CHIU SK, LUO YR, CHIANG CC, HUANG SY, CHANG YH, HSIEH YP

Synthesis and characterizations of graphene-based composite film for thermal dissipation

JOURNAL OF ALLOYS COMPOUNDS

LIN CY, LIU WR

Characterization of Young's modulus and thermal conductivity of graphene/epoxy nanocomposites

JOURNAL OF COMPOSITE MATERIALS

WANG TY, TSENG PY, TSAI JL

Determining porosity effect on the thermal conductivity of single-layer graphene using a molecular dynamics simulation

PHYSICA ELOWDIMENSIONAL SYSTEMS NANOSTRUCTURES

FANG TH, LEE ZW, CHANG WJ, HUANG CC

Ball-milled dispersed network of graphene platelets as thermal interface materials for high-efficiency heat dissipation of electronic devices

JOURNAL OF MICRONANOLITHOGRAPHY MEMS MOEMS

CHANG TC, LIAO CA, LIN ZY, FUH YK

Copper Like Thermal Conductivity and Silicon Like Coefficient of Thermal Expansion Copper Graphene for High Power IGBT by Metal Injection Molding

MATERIALS TRANSACTIONS

MOHAMMADI F, LI SS

Flexible Polyimide Films Hybrid with Functionalized Boron Nitride and Graphene Oxide Simultaneously To Improve Thermal Conduction and Dimensional Stability

ACS APPLIED MATERIALS INTERFACES

TSAI MH, TSENG IH, CHIANG JC, LI JJ

Enhanced thermal conductivity and dimensional stability of flexible polyimide nanocomposite film by addition of functionalized graphene oxide

POLYMER INTERNATIONAL

TSENG IH, CHANG JC, HUANG SL, TSAI MH