IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY
SONG B, MOON KS, WONG CP
MATERIALS RESEARCH EXPRESS
YADAV S, KAUR I
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
LIU RS, PENG MF, ZHANG HY, WAN X, SHEN MI
COMPOSITES PART BENGINEERING
PARK WB, BANDYOPADHYAY P, NGUYEN TT, KUILA T, KIM NH, LEE JH
MATERIALS RESEARCH BULLETIN
ZHANG Y, WANG ZY, LIU S, ZHANG T
MACROMOLECULAR RAPID COMMUNICATIONS
STEVENS B, GUIN T, SARWAR O, JOHN A, PATON KR, COLEMAN JN, GRUNLAN JC
MODERN PHYSICS LETTERS B
HOUSHMAND M, ZANDI MH
THIN SOLID FILMS
PETERLEVITZ AC, MAY PW, HARNIMAN RL, JONES JA, CERAGIOLI HJ, ZANIN H
MATERIALS CHEMISTRY PHYSICS
RAD AS, PAZOKI H, MOHSENI S, ZAREYEE D, PEYRAVI M
JOURNAL OF ALLOYS COMPOUNDS
SALEEM H, HABIB A