AIP ADVANCES
HEO S, KWON MG, LEE HI, KIM C, KIM SM, CHANG KE, LEE Y, LEE BH
IEEE ELECTRON DEVICE LETTERS
HEO S, KIM S, KIM K, LEE H, KIM SY, KIM YJ, KIM SM, LEE HI, LEE S, KIM KR, KANG S, LEE BH
ANNALEN DER PHYSIK
HEO S, LEE HI, LEE H, KIM SM, KIM K, KIM YJ, KIM SY, KIM JH, YOON MH, LEE BH
JOURNAL OF NANOSCIENCE NANOTECHNOLOGY
LEE HI, PARK SJ
NANOTECHNOLOGY
KIM YJ, KIM SM, HEO S, LEE H, LEE HI, CHANG KE, LEE BH
JOURNAL OF INDUSTRIAL ENGINEERING CHEMISTRY
PARK GH, KIM KT, AHN YT, LEE HI, JEONG HM
MATERIALS
PARK JH, DAO TD, LEE HI, JEONG HM, KIM BK
JOURNAL OF COLLOID INTERFACE SCIENCE
DAO TD, LEE HI, JEONG HM
JOURNAL OF MACROMOLECULAR SCIENCE PART BPHYSICS
HAN SJ, LEE HI, JEONG HM, KIM BK, RAGHU AV, REDDY KR
COLLOID POLYMER SCIENCE
DAO TD, LEE HI, JEONG HM, KIM BK