COMPOSITES PART BENGINEERING

ZHAO LJ, SUN XJ, LEI ZY, ZHAO JH, WU JR, LI Q, ZHANG AP

MICROELECTRONICS RELIABILITY

CUI TF, LI Q, XUAN YM, ZHANG P

PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA

LV RT, CHEN GG, LI Q, MCCREARY A, BOTELLOMENDEZ A, MOROZOV SV, LIANG LB, DECLERCK X, PEREALOPEZ N, CULLENI DA, FENG SM, ELIAS AL, CRUZSILVA R, FUJISAWA K, ENDO M, KANG FY, CHARLIER JC, MEUNIER V, PAN MH, HARUTYUNYAN AR, NOVOSELOV KS, TERRONES M

CARBON

CHEN JP, SHI WL, FANG D, WANG T, HUANG J, LI Q, JIANG M, LIU L, LI Q, DONG LJ, WANG Q, XIONG CX

ORGANIC ELECTRONICS

CHEN T, WANG LL, ZHANG XH, LUO KW, LI Q

DIGEST JOURNAL OF NANOMATERIALS BIOSTRUCTURES

DONG LM, WU KJ, SHI DY, LI XJ, LI Q, HAN ZD

INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE

WU SW, HUANG XL, WU YH, LUO LP, JIN YC, LI Q

ACS APPLIED MATERIALS INTERFACES

YE SY, SHAO K, LI ZH, GUO N, ZUO YP, LI Q, LU ZC, CHEN L, HE QG, HAN HY

ELECTROCHIMICA ACTA

YUE HW, WANG SY, YANG ZB, LI Q, LIN SM, HE DY

MATERIALS TECHNOLOGY

LI RQ, LI Q, ZHOU Y, CHEN KP, ZHANG CX, CHEN L, GAO L, CUI JJ