国家/地区 中国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人
公开年 2015（2）
申请年 2015（2）
专利权人 INST MICROELECTRONICS CHINESE ACAD SCI（2）

Flexible substrate based three-dimensional packaging heat radiation structure, has graphene radiating fin fixed to contact surface of chip package body, and graphite heat abstractor provided with metal carrier chip.

CAO L, GUO X, HOU F, WAN L, SU M, WANG Q, ZHOU Y

Storage device, comprises insulating substrate, lower electrode, lower barrier layer graphene, resistive functional layer and upper electrode, where resistive functional layer is located on lower barrier layer graphene.

LV H, LIU M, LIU Q, SUN H, ZHANG K, BENAGI R, BANERJEE W