国家/地区 中国（3）
IPC部 F（3）
IPC大类 F24（3）
IPC小类 F24D（3）
IPC F24D013/00（3）
发明人 TANG Y（2） YU H（2）
公开年 2016（2）
申请年 2015（3）
专利权人 TANG Y（2） YU H（2）

Graphene heating bottom plate integrated shell, has bottom plate provided with hem part, and inner heating core connected with shell body and pressing sheet, where inner heating core is fixed with bottom plate.

YE G

Semiconductor heating device, has semiconductor heating element provided with semiconductor heating plate and connected with hot end, and N-type semiconductor and P-type semiconductor made of graphene.

HUANG J, LIU W, TANG Y, TIAN Z, YU H

Semiconductor heating device, has P-type semiconductor and N-type semiconductor respectively arranged between heat end part and cold end part, where P-type semiconductor and N-type semiconductor are made of graphene material.

TANG Y, YU H