国家/地区 中国（2） 韩国（2）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4） F28F（4） C08L（3）
F28D（3） C08J（2） C09K（2）
IPC C08K003/04（4）
发明人
公开年 2020（2）
申请年 2020（4）
专利权人

High thermal conductivity and low gas permeability fluororesin tube useful for heat exchanger comprises fluororesin, thermally conductive flat filler and filler in form of nano-sized thermally conductive fibers.

CHOI J H

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y

Base material used for core carrier, is obtained by mixing graphene-coated metal material with modifier chosen from polyethylene, polyvinylidene fluoride, and polyurethane, and wetting film to obtain porous thermal conductive film material.

QIN L, LIANG P, ZHI L, ZHAN Z, CHI S, WANG L, ZHU H

High thermal conductivity graphene aluminum-plastic composite heat conductor has heat radiation groove formed on outer wall, and two branch pipes and heat conduction pipes whose connection points are provided with heat conduction cover.

CHEN F, WANG J