国家/地区 世界知识产权组织（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC
发明人
公开年 2021（2）
申请年 2020（2）
专利权人

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R