国家/地区 中国（2）
IPC部 B（2）
IPC大类 B82（2）
IPC小类 B82Y（2）
IPC C23C014/35（2）
发明人
公开年 2021（2）
申请年 2021（2）
专利权人

Preparing ultra-thin radiating fin used in electronic device, and integrated circuit , involves preparing metal radiating sheet with array pattern on surface of metal foil by nanometre stamping template, and depositing vertical graphene film array on surface.

PAN Z, TAN H

Preparing copper/graphene/copper composite material useful in national power system and integrated circuit, comprises e.g. cleaning copper foil, using direct current power supply to polish surface of copper foil, reacting and depositing.

WU L