国家/地区 日本（2）
IPC部 B（2）
IPC大类 B32（2） C09（2） H01（2）
H05（2）
IPC小类 B32B（2）
IPC H01L023/36（2）
发明人
公开年
申请年 2021（2）
专利权人

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R