国家/地区 世界知识产权组织（4）
IPC部 B（4）
IPC大类 C09（4） B05（3） C08（2）
G06（2） H05（2）
IPC小类 C09D（4）
IPC C09D175/04（4）
发明人 WU K（2）
公开年 2021（3）
申请年 2021（4）
专利权人 HEWLETTPACKA.（2）

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Self-healing electromagnetic shielding material useful in electronic device, comprises first graphene resin layer, a carbon fiber material resin layer and a second graphene resin layer that are stacked in sequence.

SUN R, TIAN D, WEI J, ZHAO Z, ZHANG L, ZHANG H, HU Y

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K

Coated substrate used in e.g. vehicles, bus bars and metal wires, contains first coating layer comprising electrodepositable coating layer, and second coating layer comprising powder coating layer on at least portion of first coating layer.

VISSER S J, WOODWORTH B E, GONDERJONES H, SCHNEIDER J R, MOORE K L, FOLLET M L, MA L, MUNRO C H, POLLUM M M, FRENCH M S, CONDIE A G, HARRISON A E, SCHWENDEMAN I G, DEI D K, BANCROFT C N, APANIUS C, SYLVESTER K T, DEDOMENIC C J, PUODZIUKYNAITE E, HOLLY G, AMII H, NOEL B C, CHRISTOPHER A, POLLUM J M M, GONDERJONES H A